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   PCB Details PCB Material Specifications
 
   Max. Board Size 457.2mm X 800 mm  ( max. )
   Min. Hole Size 0.1mm(4mil) Min.Hole Diameter for CNC Driling / By laser drilling: 0.05mm (0.002")
   Min annular ring 0.025mm
   Via hole type Blind/Burried/Plugged
   Min. Trace & wide 0.13 mm ( 5 mil )
   Material FR-4, FR408, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Halogen Free Rogers, Aluminium
 
   Board Thickness 0.2mm-6.00 mm(8mil-126mil)
   Min. Core Thickness 0.10mm ( 4 mil)
   Copper Thickness Mass production:
Min: 12um (1/3oz)
Max: 140um (4oz) for inner layer; 350um(10oz)for outer layer
Sample:
Max: 210um (6oz) for inner layer; 450um(13oz) for outer layer
   Layers 1-32 Layers
   Finishing HASL, Flux, ENIG ,OSP, RoHs HAL, Gold, NIKLE,SILVER
   Soldermask Green, Red, Blue, Black, Yellow
   Silkscreen Black, White, Yellow
 
   Warp and Twist 0.50% ~ 0.75%
   Impedance control Single trace or differential controlled 50Ω, 60Ω, 70Ω, 100Ω, 110Ω, 120Ω, 130 Ω ±5%
 
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